8D Platform
The design-led, chipset-agnostic edge compute platform - engineered to be embedded inside the world's most demanding products.
We don't sell touchscreens. We build platforms.
8D is a design-led platform company. 8D Platform is the compute foundation – silicon to cloud – that OEMs embed inside their products.
Every product family – 8D Compute, 8D TouchOne, 8D Codepad – is built on the same underlying architecture: a chipset-agnostic compute module, the eightOS embedded operating system, and the RMS cloud management layer. Customers choose how much of the stack they take, and how much of their own product they wrap around it.
The result is a platform that scales across applications – from a wall-mounted intrusion keypad, to a fire panel display, to a Pro-AV control surface, to a voice-driven edge-AI module – without re-engineering the foundation each time.
Four layers. One supplier. Designed to work together from day one.
Layer 4 - OEM Application (your code, your brand)
Your application logic, your UI, your customer-facing experience. The platform is invisible underneath.
Layer 3 - RMS Cloud
Provisioning, telemetry, alerting, and over-the-air updates across every device you ship. Multi-tenant by design – your fleet stays yours.
Layer 2 - eightOS
Our hardened embedded operating system. Android or Linux variants, locked down for security, with a managed update pipeline and long-lifecycle support.
Layer 1 - 8D Compute (the silicon)
The board. Chipset-agnostic by design – Qualcomm, Allwinner, or Rockchip – sized to the performance, cost, and AI envelope of your application.
Chipset-agnostic is a deliberate strategy - not a parts list.
Different applications need different silicon. A low-power keypad has different requirements to an AI-driven control surface, and both differ from a high-resolution Pro-AV touch panel. 8D Platform is engineered so that the same eightOS, the same RMS, and the same manufacturing process run across a curated set of silicon options.
That means you choose the silicon that fits your product – not the other way round.
Qualcomm QCS2290 - Premium tier
High-performance ARM compute, integrated AI acceleration, and the foundation for our Qualcomm partnership and CES 2027 module. Best for AI-at-the-edge, voice interaction, and demanding UI workloads.
Allwinner A133 - Balanced tier
Proven quad-core ARM compute at a price point that scales to volume. Best for general-purpose embedded UI, security keypads, and mid-range control surfaces.
Rockchip RK3506 - Efficiency tier
Low-power, cost-optimised compute for high-volume, fixed-function applications.
WHY THIS MATTERS
Most embedded platforms lock you into a single silicon vendor. That is a commercial risk and a roadmap risk. 8D Platform is engineered so eightOS, RMS, and the manufacturing flow are decoupled from the chipset – which means you can migrate silicon tiers without re-architecting your product.
Premium silicon. Co-marketing reach. A CES 2027 stage.
8D is Qualcomm’s security platform partner. The next generation of 8D Compute – built on Qualcomm Snapdragon silicon – will be showcased on the Qualcomm stand at CES 2027 and is being promoted globally through Qualcomm’s worldwide sales channel.
For OEMs building on 8D Platform, the partnership delivers three concrete advantages:
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Direct access to the Qualcomm roadmap, including early visibility into next-generation silicon. -
Co-marketing reach into security, fire, building automation, and commercial AV verticals through the Qualcomm channel.
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A premium-tier compute foundation engineered for the workloads - edge AI, voice, video - that define the next decade of connected devices.
The commercial case for building on 8D Platform.
Long lifecycle by design.
Mission-critical devices ship for 10+ years. 8D Platform is engineered for long-cycle component availability, security patching, and OS support - not the 18-month cycles of consumer hardware.
IP reuse across your portfolio.
Once your application runs on 8D Platform, it runs across every form factor and silicon tier we offer. One integration. Multiple SKUs.
OEM customisation, end to end.
Your brand, your UI, your enclosure, your packaging. The platform underneath is invisible to your customer - and to your competition.
One supplier. One contract. One support model.
Hardware, OS, cloud, and manufacturing under a single Services Master Agreement. No four-vendor finger-pointing when something goes wrong.